UPSI Digital Repository (UDRep)
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UPSI Digital Repository (UDRep)
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| Abstract : Perpustakaan Tuanku Bainun |
| The objective of this study is to design and develop a piezoelectric micromachined ultrasonic transducer (pMUT). The developed pMUTs are then characterized and verified for underwater applications. PDMS and epoxy thick films are deposited using the spin-coating technique. The wafer bonding method is employed to adhere to the functional and structural layers. Bonding quality is analysed using FESEM images while material interaction is studied using EDS analysis. Electrical characterization is carried out on all developed pMUTs using impedance analysis. Finally, the receiving and transmitting responses are determined and verified using the pulse-echo technique in a freshwater tank. All pMUTs are successfully constructed, with overall thicknesses ranging from 880 to 980 _m. PDMS and Epoxy thick films are uniformly deposited at 1000 rpm. A strong bonding between the piezoelectric active layer and the silicon substrate is observed using PDMS as an adhesive, with a minimum thickness of 26.42 _m and a maximum of 64.76 _m. It is verified that the speed of sound is measured at 1333.3 ms-1 using the developed pMUT. At an operating frequency of 100 kHz, the DUT utilizing PDMS adhesive demonstrated 66% higher sensitivity in receiving mode and 71% more sensitivity in transmitting mode compared to the DUT using epoxy. PDMS adhesive has also contributed to a wider operating frequency while epoxy adhesive carries a deadspace below 80 kHz of operating frequency. In conclusion, pMUTs for underwater applications can be fabricated using the wafer bonding method. The performance of all developed pMUTs has been measured through mechanical characterization, electrical analysis, and underwater verification. It is found that the proposed wafer bonding method simplifies the fabrication of pMUT. The usage of PDMS as an adhesive has contributed to increased sensitivity while maintaining operating bandwidth. |
| References |
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PUBLICATIONS
Harun, J. W., Yaacob, M. I. (2021). Ultrasonic transducer tuning using wafer bonding method. Indian Journal of Geo-Marine Sciences, 50(11). Harun, J. W., Yaacob, M. I. (2021). In-situ ultrasonic transducer tuning using wafer bonding method for underwater sonar applications. Department of Physics, Faculty of Science and Mathematics Sultan Idris Education University. Harun, J. W., Yaacob, M. I., Nawi, M. N. (2019). pMUT structure enhancement using the wafer transfer approach. Department of Physics, Faculty of Science and Mathematics Sultan Idris Education University.
CONFERENCE
Harun, J. W., Jaafar, R., Yaacob, M. I. (2018). Piezoelectric Micromachined Ultrasonic Transducer (pMUT): A Short Review on Latest Advancement. The 6th International Postgraduate Conference on Science and Mathematics 2018 (IPCSM 2018).
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