The objective of this study is to design and develop a piezoelectric micromachined ultrasonic transducer (pMUT). The developed pMUTs are then characterized and verified for underwater applications. PDMS and epoxy thick films are deposited using the spin-coating technique. The wafer bonding method is employed to adhere to the functional and structural layers. Bonding quality is analysed using FESEM images while material interaction is studied using EDS analysis. Electrical characterization is carried out on all developed pMUTs using impedance analysis. Finally, the receiving and transmitting responses are determined and verified using the pulse-echo technique in a freshwater tank. All pMUTs are successfully constructed, with overall thicknesses ranging from 880 to 980 _m. PDMS and Epoxy thick films are uniformly deposited at 1000 rpm. A strong bonding between the piezoelectric active layer and the silicon substrate is observed using PDMS as an adhesive, with a minimum thickness of 26.42.....

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